Ekyuma kya SAKI 3Di-MS3 SMT 3D AOI

SAKI 3Di-MS3 mulembe mupya ogw’ebyuma ebikebera amaaso mu ngeri ya 3D automatic optical inspection (AOI), ebikoleddwa okukebera PCB assembly (PCBA) mu ngeri entuufu. Ekyuma kino kikozesa tekinologiya wa multi-spectral imaging + 3D laser scanning, nga kigatta wamu ne AI deep learning algorithms, okuzuula obulungi omutindo gw’okuweta ebipapula ebizibu nga 01005 ultra-small components, BGA, QFN, CSP, n’ebirala, okutuukiriza ebyetaago by’amakolero ag’obwesigwa obw’amaanyi nga ebyuma by’emmotoka, ebyuma eby’obujjanjabi, n’eby’omu bwengula.

2. Ebikwata ku nsonga enkulu

1. Enkola y’okuzuula amaaso

Ebikwata ku Parameters

Tekinologiya w’okuzuula 3D Laser Triangulation + Okukuba ebifaananyi mu langi ez’enjuyi nnyingi

Obulungi obusinga obunene 16MP (4928×3264 Pixels)

Ekitundu ekitono ekizuulibwa 008004 Package (0.25×0.125mm)

Z-axis Okupima Obutuufu ±3μm

Sipiidi y’okuzuula ≤0.3 Sikonda/Ekifo ky’okuzuula

Enkola y’ensibuko y’ekitangaala Programmable Multi-angle RGB-IR Hybrid Light Source

2. Enkola y’Ebyuma

Ebikwata ku Parameters

Sayizi ya PCB esinga obunene 610mm×510mm (eky’okwesalirawo okutuuka ku 800mm)

Obutuufu bw’okuteeka ekifo mu mitendera ±3μm

Enkola y'entambula Linear Motor Drive + Empewo Bearing

Z-axis Okutereeza Obuwanvu 0-60mm (Autofocus)

3. Enkola ya pulogulaamu ey’amagezi

Enkola y’okuzuula: CNN convolutional neural network + okuzuula amateeka ag’ennono

Ebintu ebizuuliddwa:

Ebikyamu mu kifo kya solder (ebiyungo bya solder eby’obulimba/short circuits/ebbaati etamala)

Ebikyamu mu bitundu (ebitundu ebibula/ebitundu ebikyamu/offset/amayinja g’entaana) .

Okupima enkula ya 3D (coplanarity/solder paste volume) .

Enkolagana ya data: okuwagira SECS/GEM, MES docking

Ebifulumizibwa mu lipoota: PDF/Excel/enkola eya custom

4. Ebyetaago by’obutonde bw’ensi

Ebyetaagisa mu Parameters

Ebbugumu ly’okukola 18-26°C (okuteesa kw’ebbugumu buli kiseera)

Obunnyogovu buba 40-60%RH

Amaanyi ageetaagisa 220V±5%/50Hz/3kVA

Empewo enyigirizibwa 0.5MPa (enyonjo era nkalu) .

Obuzito bw’ebyuma Nga 1500kg

III. Ebikulu ebikwata ku nkozesa

1. Ensonga enkulu ez’okukola obulungi

Obukuumi bwa layisi: Totunula butereevu mu kitangaala kya layisi (Class 2M laser) .

Obukuumi mu mizannyo: Okukebera bbaatuuni y’okuyimirira mu bwangu waakiri omulundi gumu mu wiiki

Obukuumi bw’amasannyalaze agatali gakyukakyuka: Yambala akakomo akaziyiza okutambula ng’okwata ku PCB

2. Enkola y’emirimu etuukiridde

Enkola y’okutandikawo:

Ggyako amasannyalaze amakulu → Tandika kompyuta y’amakolero → Tandika enkola y’okutambula (sekonda nga 90)

Kola okupima buli lunaku (nga mw’otwalidde: okupima okw’amaaso/okupima obuwanvu obujuliziddwa)

Okuteekateeka ebigezo:

Okuteeka PCB mu kifo kyetaagisa okukozesa ebikozesebwa eby’enjawulo (okugumiikiriza ±0.1mm) .

Ebikozesebwa ebipya byetaaga okuteekawo etterekero ly’ebitundu bya 3D (kirungi okukung’aanya sampuli ≥5)

Okulongoosa kwa parameter:

Ku bitundu ebitangaaza ennyo (nga QFN), okuzuula okuyungibwa okw’enjawulo (multi-spectral fusion detection) kwetaaga okusobozesa

Ku byuma ebiriko ppini ennene, kirungi okukozesa enkola ya sikaani ey’omu kitundu

3. Enkola y’okuddaabiriza

Ebintu eby’okuddaabiriza cycle Standard

Buli lunaku Okwoza amadirisa mu maaso Kozesa olugoye olw’enjawulo olutaliimu nfuufu + ekyuma ekiyonja amaaso

Weekly Guide okusiiga n’okuddaabiriza eggaali y’omukka Kozesa giriisi ya NSK LGHP2

Buli mwezi Okuzuula amaanyi ga Laser Attenuation rate ≤5%/omwaka

Buli luvannyuma lwa myezi esatu Okupima okutuufu okujjuvu Kozesa olubaawo olwa mutindo olukakasibwa NIST

IV. Ebigonjoola ebizibu ebya bulijjo

1. Enkola y’ebyuma okulemererwa

Ekintu ekilemererwa: amaloboozi agatali ga bulijjo/okukyama mu kifo ky’entambula ya siteegi

Ebiyinza okuvaako ensonga eno:

Obutasiiga bumala ku ggaali y’omukka elungamya

Obujama bwa encoder

Servo motor okubuguma ennyo

Okugonjoola:

Enkola y’okukwata ku kulemererwa

1. Kola enkola y’okusiiga mu ngalo

2. Yoza enkoda n’ethanol atalina mazzi

3. Kebera embeera y’okukola kwa cooling fan

4. Kola okupima okuliyirira giridi

2. Enkola y’amaaso okulemererwa

Ekintu ekilemererwa: 3D point cloud data obutali bwa bulijjo

Emitendera gy’okuzuula obulwadde:

Kebera vvulovumenti y’amasannyalaze ga layisi (24V±0.5V) .

Kakasa omuwendo gw’ekipimo ky’olubaawo lw’okupima

Kebera okutaataaganyizibwa kw’ekitangaala ekiri mu kifo

Ebikolwa eby’amangu:

Ssobozesa okumala akaseera 2D detection mode

Teekateeka amaanyi ga layisi (80-120% range)

V. Obukugu obw’omulembe mu kukozesa

1. Okulongoosa mu kuzuula ebintu eby’enjawulo

Ceramic substrate: Ssobozesa okuzuula bbandi ya infrared (module ya IR ey’okwesalirawo yeetaagibwa)

Flexible PCB: Kozesa enkola ya segmented scanning mode (okukendeeza ku situleesi y’ebyuma)

2. Okulongoosa enkola y’okuzuula

Tekinologiya w’okukola ebintu mu ngeri ey’enjawulo:

Ekyokulabirako ky’okulongoosa

Enkola ey’ennono: Okuzuula mu mutendera → 0.5 seconds/point

Enkola y’okulongoosa: Regional parallel → 0.2 seconds/point

Enkola y’okukebera ey’okubuuka mu ngeri ey’amagezi: okukendeeza mu ngeri ey’otoma obungi bw’okukebera mu bitundu ebigezesebwa ebirina ebisaanyizo

VI. Enkola y’okuwagira eby’ekikugu

Okuzuula okuva ewala: okuwagira okuyungibwa kwa VPN mu kiseera ekituufu (kyetaagisa okuteeka fayiro nga bukyali)

Enzirukanya y’okukyusa sipeeya:

Layisi: essaawa ≥20,000

Kkamera y’amakolero: essaawa ≥50,000

Empeereza y’okupima: Kirungi okupima ekkolero eryasooka omulundi gumu mu mwaka