SAKI BF-10D SMT 2D umatshini AOI

SAKI 2D AOI BF-10D Iinkcukacha zoBugcisa eziPheleleyo

1. Isishwankathelo seMveliso kunye nokuma kweMarike

Imvelaphi yeMveliso

I-SAKI BF-10D sisizukulwana esitsha se-2D sokuhlola okuzenzekelayo (i-AOI) izixhobo eziqaliswe ngu-SAKI Co., Ltd. yaseJapan, eyenzelwe ukulawula umgangatho ophezulu we-PCB wokuvelisa. Xa kuthelekiswa nesizukulwana sangaphambili se-BF-Planet-XII, i-BF-10D iye yaphucula kakhulu kwisantya sokubona, i-algorithm yobulumko kunye nokuzinza kwenkqubo.

Ukuma kwemarike

Imizi-mveliso ekujoliswe kuyo: i-elektroniki yabathengi abakwisiphelo esiphezulu (njengeebhodi ze-smartphone), i-automotive electronics (iimodyuli ze-ADAS), ii-semiconductor packaging substrates.

Iinzuzo zokhuphiswano:

Ishishini elikhokelayo ±10μm ukuchaneka kokubona

Itekhnoloji eyodwa "yokubonwa okuhambelanayo kwengoma ezimbini" yonyusa umthamo wemveliso ngama-30%

Ixhasa inkqubo ye-AI yokufundela isiphene

2. Ubuchwephesha obungundoqo kunye neenkcukacha ze-hardware

Inkqubo yokubona

IiNkcazo zeZiqendu Iimpawu zobuGcisa

Inkqubo yokucinga 12MP isivalo jikelele CMOS Ixhasa 6μm/pixel isisombululo

Inkqubo yokukhanyisa i-8-way programmable RGBW LED Wavelength range 380-850nm

I-Optical zoom yoMbane yokusondeza i-zoom eqhubekayo 0.5X-5X yokwandisa inyathelo

Inkqubo yoomatshini

Iqonga lentshukumo:

Umgca wemoto wokuqhuba, ukuchaneka kokubeka okuphindaphindwayo ± 3μm

Isantya esiphezulu sokuskena 1.2m/s

Ubungakanani besubstrate:

Uhlobo oluqhelekileyo: 510×460mm (yandiswa ukuya ku-610×610mm)

Ukutyeba ububanzi: 0.2-6mm

Iiparamitha eziphambili

Izalathi zeParameters

Ubuncinci ubungakanani bokubona 10μm

Isantya sokubona imizuzwana eyi-0.03/inqaku lovavanyo (inqaku elilula)

Isantya se-alarm yobuxoki <0.5% (ivavanywe ngumgangatho we-IPC)

Unxibelelwano lonxibelelwano 10G Ethernet + SECS/GEM

3. Inkqubo yesoftware kunye nobuchule bokubona

Iqonga lesoftware yeVisionPro X

Imowudi yokubona:

Ukuchongwa kwe-Solder Paste (imo ye-SPI)

Ukubonwa kwePost-Mount (Post-Mount)

Ukubhaqwa kwangethuba lokuqukuqela (Post-Reflow)

I-algorithm ekrelekrele:

Ukuhlelwa kwesiphene ekufundeni nzulu (ixhasa iintlobo ze-100+ zeziphene)

Itekhnoloji yembuyekezo yokulinganisa ye-3D yokulinganisa

Izinto zokubona eziqhelekileyo

Isigaba senkqubo Uhlobo lwesiphene olubonakalayo

Ukuprintwa kwe-Solder Cola I-tin encinci, i-bridging, i-tip yokutsala, i-offset

Ukufakwa kwecandelo Amalungu alahlekileyo, iindawo ezingalunganga, i-polarity ebuyela umva, ilitye lengcwaba

I-Reflow soldering I-soldering ebandayo, amaso e-tin, i-tombstone effect, iibhola ze-solder

4. Ufakelo lwezixhobo kunye neemfuno zokusingqongileyo

Ukulungiswa kwendawo

IiMfuno zeProjekthi

Ukuthe tyaba komhlaba ≤0.02mm/m²

Iqondo lobushushu lokusingqongileyo 23±2℃ (indibano yokusebenzela yobushushu rhoqo)

Ulawulo lokufuma 45-65% RH

Ucoceko Class 10000 okanye ngaphantsi

Iimfuno zombane

Unikezelo lwamandla: 200V AC ± 10%, 50/60Hz, isiseko esisodwa (ukumelana nomgangatho <4Ω)

Umthombo womoya: 0.5MPa umoya ococekileyo owomileyo (indawo yombethe ngaphantsi -20℃)

5. Iinkqubo zokusebenza ezisemgangathweni kunye nezilumkiso

Inkqubo yokuxhoma amandla

Layita amandla aphambili → linda inkqubo yokuzijonga ukuba igqibe (malunga nemizuzwana engama-90)

Qala isoftware yeVisionPro X → layisha inkqubo yemveliso ehambelanayo

Yenza ulungelelwaniso lwemihla ngemihla (ipleyiti yokulinganisa eqhelekileyo iyafuneka)

Izilumkiso eziphambili

Ukugcinwa kwamehlo:

Sebenzisa intonga yobuchwephesha bokucoca ukucoca ilensi veki nganye

Buyisela isihluzo se-UV rhoqo kwiiyure ezingama-500

Inkqubo yentshukumo:

Sukutyhala inqanaba le-XY ngesandla (ingonakalisa ikhowudi yomgca)

Yongeza igrisi rhoqo ngenyanga (sebenzisa isithambiso esikhethekileyo se-SAKI)

6. Iikhowudi zeempazamo eziqhelekileyo kunye nezisombululo

Iimpazamo zeHardware

Code Phenomenon Solution

E1101 unxibelelwano lwekhamera ixesha liphelile Jonga intambo yeKhonkco yeKhamera → qalisa kwakhona ikhadi lokufumana umfanekiso

E2105 Z-axis servo alarm Jonga isiporo somcimbi wangaphandle → seta kwakhona i-servo drive

E3208 Ubushushu bomthombo wokukhanya buphezulu kakhulu. Coca ifeni yokupholisa → nciphisa amandla okukhanyisa

Impazamo yesoftware

Code Phenomenon Solution

SW404 Ukufunyanwa kwedatha kuphuphuma. Yandisa inkqubo yememori yenyani → khulisa ulwahlulo lwendawo yobhaqo

Ukulayisha imodeli ye-SW507 AI akuphumelelanga. Phinda ungenise imodeli yefayile → hlaziya umqhubi weGPU

7. Ugcino nogcino

Ukugcinwa kwamaxesha ngamaxesha

Ixesha lokugcinwa kwezinto Indlela esemgangathweni

I-Daily Track yokucoca ilaphu elingenaluthuli + IPA ukosula

Ulungelelwaniso lweVeki lwe-Optical Sebenzisa ipleyiti elandelekayo ye-NIST elandelekayo

Monthly Motion system lubrication isixa sokutofa igrisi 0.3ml/kaloliwe

Ngekota Umthombo wokukhanya wokuthomalalisa iFotometer ilinganisa izinga lokuthomalalisa ukukhanya

8. Iimeko zesicelo soshishino oluqhelekileyo

Ityala le-1: Ukufunyanwa kwebhodi ye-motherboard yefowuni

Iimfuno zabathengi:

Khangela iziphene zebhola ye-solder ye-0.3mm BGA

Ixesha lokuhlola ibhodi enye <15 imizuzwana

Isisombululo:

Vula i-5X yokusondeza yokukhanya + imowudi yokukhanyisa iringi

Sebenzisa i-AI ukuhluza iziphene zepseudo (ezifana nentsalela ye-flux)

Ityala le-2: Ukuhlolwa kwe-ECU yeemoto

Iimfuno ezizodwa:

Ukuthobela imigangatho yokuthembeka kwe-AEC-Q100

I-100% yokulandeleka kweerekhodi zokuhlolwa

Isicwangciso sophumezo:

Yongeza umfanekiso we-infrared thermal ukuncedisa ekubhaqweni kweendawo ezibandayo ze-solder

Ukudityaniswa okunzulu kunye nenkqubo ye-MES