SAKI BF-10D SMT 2D AOI machine

SAKI 2D AOI BF-10D Full Technical Detail

1. Product Overview and Market Positioning

Product Background

SAKI BF-10D is a new generation of 2D automatic optical inspection (AOI) equipment launched by SAKI Co., Ltd. of Japan, designed for high-precision PCB manufacturing quality control. Compared with the previous generation BF-Planet-XII, BF-10D has significantly improved in detection speed, algorithm intelligence and system stability.

Market positioning

Target industries: high-end consumer electronics (such as smartphone motherboards), automotive electronics (ADAS modules), semiconductor packaging substrates

Competitive advantages:

Industry-leading ±10μm detection accuracy

Unique "dual-track synchronous detection" technology increases production capacity by 30%

Supports AI self-learning defect classification system

2. Core technologies and hardware specifications

Optical system

Components Specifications Technical features

Imaging system 12MP global shutter CMOS Supports 6μm/pixel resolution

Lighting system 8-way programmable RGBW LED Wavelength range 380-850nm

Optical zoom Electric continuous zoom lens 0.5X-5X stepless zoom

Mechanical system

Motion platform:

Linear motor drive, repeatable positioning accuracy ±3μm

Maximum scanning speed 1.2m/s

Substrate size:

Standard type: 510×460mm (expandable to 610×610mm)

Thickness range: 0.2-6mm

Core parameters

Parameters Indicators

Minimum detection size 10μm

Detection speed 0.03 seconds/test point (simple feature)

False alarm rate <0.5% (tested by IPC standard)

Communication interface 10G Ethernet + SECS/GEM

3. Software system and detection capabilities

VisionPro X software platform

Detection mode:

Solder paste detection (SPI mode)

Post-mount detection (Post-Mount)

Post-reflow detection (Post-Reflow)

Intelligent algorithm:

Deep learning defect classification (supports 100+ defect types)

3D simulation imaging compensation technology

Typical detection items

Process stage Detectable defect type

Solder paste printing Less tin, bridging, pull tip, offset

Component mounting Missing parts, wrong parts, reverse polarity, tombstone

Reflow soldering Cold soldering, tin beads, tombstone effect, solder balls

4. Equipment installation and environmental requirements

Site preparation

Project Requirements

Ground flatness ≤0.02mm/m²

Environmental temperature 23±2℃ (constant temperature workshop)

Humidity control 45-65% RH

Cleanliness Class 10000 or below

Electrical requirements

Power supply: 200V AC±10%, 50/60Hz, single grounding (grounding resistance <4Ω)

Air source: 0.5MPa clean dry air (dew point below -20℃)

5. Standard operating procedures and precautions

Power-on procedure

Turn on the main power → wait for the system self-check to complete (about 90 seconds)

Start VisionPro X software → load the corresponding product program

Perform daily calibration (standard calibration plate required)

Key precautions

Optical maintenance:

Use professional optical cleaning stick to clean the lens every week

Replace UV filter every 500 hours

Motion system:

Do not push the XY stage manually (may damage the linear encoder)

Add grease every month (use SAKI special lubricant)

6. Common fault codes and solutions

Hardware faults

Code Phenomenon Solution

E1101 Camera communication timeout Check the Camera Link cable → restart the image acquisition card

E2105 Z-axis servo alarm Check the rail for foreign matter → reset the servo drive

E3208 The light source temperature is too high. Clean the cooling fan → reduce the lighting intensity

Software fault

Code Phenomenon Solution

SW404 Detection data overflow. Expand the system virtual memory → optimize the detection area division

SW507 AI model loading failed. Re-import the model file → update the GPU driver

7. Maintenance and maintenance specifications

Periodic maintenance

Period Maintenance items Standard method

Daily Track cleaning Dust-free cloth + IPA wiping

Weekly Optical calibration Use NIST traceable standard plate

Monthly Motion system lubrication Grease injection amount 0.3ml/rail

Quarterly Light source attenuation detection Photometer measures the illuminance attenuation rate

8. Typical industry application cases

Case 1: Smart phone motherboard detection

Customer needs:

Detect 0.3mm pitch BGA solder ball defects

Single board inspection time <15 seconds

Solution:

Enable 5X optical zoom + ring lighting mode

Use AI to filter out pseudo defects (such as flux residue)

Case 2: Automotive ECU inspection

Special requirements:

Comply with AEC-Q100 reliability standards

100% traceability of inspection records

Implementation plan:

Add infrared thermal imaging to assist in the detection of cold solder joints

Deep integration with MES system