SAKI smt 3d x-reyi bf-3axim200

I-SAKI X-RAY BF-3AXiM200 Iinkcukacha ezigcweleyo zobuGcisa

1. Isishwankathelo seMveliso kunye nezinto eziluncedo ezingundoqo

Ukubekwa kweMveliso

I-SAKI BF-3AXiM200 yinkqubo yokuhlola ezenzekelayo ye-X-ray ye-3D ephuhliswe ngu-SAKI waseJapan, ingakumbi:

Ukupakishwa koxinano oluphezulu (okufana neFC-BGA, iSiP)

Iimoto zombane (imodyuli ye-ADAS, imodyuli yamandla)

Ishishini lomkhosi kunye ne-aerospace (i-PCB ethembekileyo ephezulu)

Iinzuzo ezintlanu eziphambili

Ukuskena kwe-CT ye-axis ezintathu: intshukumo ye-X/Y/Z ye-axis ehambelanayo ukufezekisa umfanekiso we-3D oyinyani

I-Nano focus X-ray ityhubhu: 0.3μm isisombululo (ishishini elikhokelayo)

Uhlalutyo lwesiphako se-AI: I-algorithm yokufunda enzulu ihlela ngokuzenzekelayo iindidi ezingama-30+ zeziphene ze-welding

Imifanekiso ye-spectrum yamandla amabini: Inokwahlula iingoma ezahlukeneyo ze-solder ezifana ne-Sn/Pb/Ag

Ukhuseleko olukrelekrele lokhuseleko: Ukuvuza kwemitha <1μSv/h (esezantsi kakhulu kunomgangatho wesizwe)

2. Iinkcukacha zobugcisa kunye nokwakhiwa kwenkqubo

Ubumbeko lwe-Hardware

Inkqubo engaphantsi kweeparamitha zobuGcisa Iimpawu

X-ray umthombo 160kV/65W ityhubhu evaliweyo Tungsten ekujoliswe, ubomi ≥ 50,000 iiyure

Umtshina 2048×2048 pixel flat panel 100fps ukufunyanwa okuguquguqukayo

I-Mechanical system I-Linear motor drive Phinda ukuchaneka kwendawo ± 2μm

Inkqubo yokukhusela i-0.5mm ehamba phambili elinganayo yokuvala umnyango + i-inshurensi yokuyeka ngokukhawuleza kabini

Iimpawu eziphambili zokusebenza

Izalathi zeParameters

Ubukhulu bebhodi yokuhlola ubukhulu be-610 × 508mm

Ubuncinci isiphene esibonakeleyo yi-0.5μm (i-copper wire open circuit)

3D ukuchaneka ngokutsha ±5μm@50mm FOV

Isantya sokuhlola esiqhelekileyo imizuzwana eyi-15/iqhekeza (200μm umaleko ubukhulu)

3. Ukufunyanwa kwesakhono kunye nemisebenzi yesoftware

Izinto zokubona

Iziphene zokusoda:

I-BGA / CSP: i-voids, i-soldering ebandayo, i-bridging

Nge-soldering ye-hole: ukuzaliswa kwe-tin okwaneleyo, i-wicking effect

Iziphene zeNdibano:

Ukususwa kwelungu, ukungabikho, impazamo yepolarity

Imisebenzi yesoftware yeVisionX3D

Imowudi yokuqonda ekrelekrele:

Ukucwangcisa isilayi esizenzekelayo (ixhasa ukutshekisha ukuskena)

Ukwahlulahlula ngokwenyani kwe3D (uqwalaselo kuyo nayiphi na iengile)

Uhlalutyo lwedatha:

Amanani-manani omlinganiselo ongenanto (ihambelana ne-IPC-7095 esemgangathweni)

Veza ingxelo yeORT ngokuzenzekelayo (kuquka imodeli ye-3D)

4. Iimfuno zofakelo kunye neenkcukacha zokusebenza

Ukulungiswa kwendawo

Iimfuno zeprojekthi

Ukuthwala umthwalo ophantsi ≥1500kg/m²

Ubushushu be-Ambient 20±3℃ (ubushushu obuhlala buhleli)

Uluhlu lokufuma 30-60% RH

Iinkcukacha zobonelelo lwamandla 220V±5%/50Hz (isiseko esizimeleyo)

Amanqaku okusebenza ngokhuseleko

Ulandelelwano lwamandla:

Qala isipholile samanzi kuqala → emva koko uqalise inkqubo ye-X-reyi → ekugqibeleni qalisa isoftwe

Ukubekwa kwesampuli:

Sebenzisa isithwali se-ceramic (ukuphepha ukuphazanyiswa kwemifanekiso yesinyithi)

Umphetho webhodi ngu-≥50mm ukusuka kwi-bulkhead

5. Ukuxilongwa kwempazamo eqhelekileyo kunye nonyango

Impazamo yeHardware

Code Phenomenon Solution

XE101 X-reyi ityhubhu overheating Jonga ukuhamba kwenkqubo yokupholisa amanzi (imfuno ≥2L/min)

ME205 Z-axis servo abnormality Qalisa kwakhona umqhubi → Jonga ukucoceka kwesikali sokulinganisa

DE308 Akukho mqondiso ovela kwi-detector Phinda ufake i-interface ye-Camera Link

Impazamo yesoftware

Ikhowudi Unobangela Isisombululo

3DERR07 Ulwakhiwo ngokutsha aluphumelelanga Nciphisa ukutyeba kwesilayi (kuyacetyiswa ≥100μm)

Imodeli ye-AICONF02 AI yokulayisha ixesha lokuphuma Hlaziya umqhubi we-CUDA kwinguqulo 11.4+

I-DBFULL11 Database igcwele Coca idatha yembali okanye wandise ukugcinwa

Ukuphathwa kwengxaki yomfanekiso oqhelekileyo

Umfanekiso mfiliba:

Jonga imowudi yetyhubhu yeX-reyi (yenqaku/imowudi yomgca

Coca ifestile yokukhusela i-detector

Uphazamiseko lwe-Artifact:

Yenza intsimi emnyama/ulungiso oluqaqambileyo

Lungisa i-KV/μA indibaniselwano yepharamitha

6. Isikhokelo sogcino

Ukugcinwa kwamaxesha ngamaxesha

Ixesha lokugcinwa komxholo Indlela esemgangathweni

Ukususwa kothuli lwemihla ngemihla kwikhabhinethi Sebenzisa isicoci se-anti-static vacuum

Ngeveki Lubricate iindawo ezihambayo Faka igrisi ye-KLUBER

Ukuhlolwa kokhuseleko lokusasazeka kweNyanga Sebenzisa i-dosimeter ye-6150AD

Ngekota Ulungelelwaniso lwetyhubhu yeX-reyi Sebenzisa iindawo zokulinganisa ezisemgangathweni ze-SAKI

Utshintsho olusebenzisekayo

Amanqaku umjikelo wokuTshintshwa kwamacandelo

X-ray ityhubhu ≥30,000 iiyure Kufuneka ukutshintshwa umenzi wokuqala

Ifilimu ekhuselayo ye-detector Iinyanga ezili-12 Ifilimu eqhubayo kufuneka isetyenziswe

Amanzi okupholisa iinyanga ezi-6 Amanzi adityanisiweyo ayafuneka

7. Iimeko zesicelo eziqhelekileyo

Imeko 1: Ukubona isokhethi ye-CPU yeseva

Imingeni:

I-LGA3647 socket efihliweyo yokubona i-solder edibeneyo

Imfuneko yomlinganiselo ongenanto <15% (ngokwe-IPC-7095C)

Isisombululo:

Sebenzisa i-60° imowudi yethambeka yokuskena

Umlinganiselo we-3D womthamo webhola ye-solder nganye

Ityala 2: Imodyuli ye-IGBT yesithuthi sombane

Iimfuno ezizodwa:

Khangela Al wire bonding isimo

Ukwahlula i-SnAgCu kwi-PbSn solder

Indlela yokuphumeza:

Yenza ukuskena kwe-spectrum yamandla amabini (80kV/130kV switching)

Imodeli yohlelo lwe-AI olulungiselelweyo

Isishwankathelo sobugcisa

I-BF-3AXiM200 ichaza kwakhona imigangatho yoshishino ngeempumelelo ezintathu eziphambili zobuchwepheshe:

I-imaging innovation: I-Nano focus + photon counting detector ukufezekisa ukufunyanwa kwenqanaba le-submicron

Uhlalutyo lobukrelekrele: Isiphene se-3D inkqubo yokuhlela ngokuzenzekelayo esekwe kufundo olunzulu

Uyilo loKhuseleko: Ukhuseleko oluninzi luqinisekisa umngcipheko wokusasazeka kwemitha kubaqhubi