SAKI X-RAY BF-3AXiM200 Zambiri Zaukadaulo
1. Chidule cha mankhwala ndi Ubwino Wapakati
Kuyika Kwazinthu
SAKI BF-3AXiM200 ndi njira yowunikira yokha ya 3D X-ray yopangidwa ndi SAKI waku Japan, makamaka:
Kupaka kwapamwamba kwambiri (monga FC-BGA, SiP)
Zamagetsi zamagalimoto (module ya ADAS, module yamagetsi)
Makampani ankhondo ndi zakuthambo (PCB yodalirika kwambiri)
Zisanu zabwino zabwino
Kusanthula kwa CT kolumikizana ndi ma axis atatu: X/Y/Z axis synchronous movement kuti mukwaniritse kujambula kwenikweni kwa 3D
Nano focus X-ray chubu: 0.3μm kusamvana (kutsogola kwa mafakitale)
Kusanthula zolakwika za AI: Kuphunzira mwakuya kumangoyika mitundu 30+ ya zolakwika zowotcherera
Kujambula kwapawiri kwamphamvu: Kutha kusiyanitsa mitundu yosiyanasiyana ya solder monga Sn/Pb/Ag
Chitetezo chanzeru: Kutayikira kwa radiation <1μSv/h (kutsika kwambiri kuposa muyezo wadziko)
2. Mafotokozedwe aukadaulo ndi kapangidwe kake
Kukonzekera kwa Hardware
Magawo a Subsystem Technical
X-ray gwero 160kV/65W chatsekedwa chubu Tungsten chandamale, moyo ≥ maola 50,000
Detector 2048 × 2048 pixel flat panel 100fps kupeza zamphamvu
Makina opangira ma Linear motor drive Bwerezani malo olondola ± 2μm
Dongosolo lachitetezo 0.5mm chotsogola chofanana ndi Door interlock + inshuwaransi yoyimitsa mwadzidzidzi kawiri
Zizindikiro zazikulu za ntchito
Zizindikiro za Parameters
Kukula kwakukulu kwa bolodi 610 × 508mm
Chilema chocheperako 0.5μm (waya yamkuwa yotseguka)
3D kumanganso kulondola ± 5μm@50mm FOV
Liwiro loyendera masekondi 15/kagawo (200μm wosanjikiza makulidwe)
3. Kutha kuzindikira ndi ntchito zamapulogalamu
Zinthu zozindikira
Zowonongeka za soldering:
BGA / CSP: voids, soldering ozizira, mlatho
Kudzera m'bowo soldering: kudzaza malata osakwanira, zotsatira zowotcha
Zowonongeka kwa Assembly:
Kusintha kwazinthu, kusowa, cholakwika cha polarity
VisionX3D ntchito mapulogalamu
Njira yodziwira mwanzeru:
Kukonzekera kwa magawo odzipangira okha (amathandizira kupendekeka)
Gawo la 3D virtual (zowonera pa ngodya iliyonse)
Kusanthula deta:
Ziwerengero zopanda pake (zogwirizana ndi IPC-7095 muyezo)
Pangani lipoti la ORT (kuphatikiza mtundu wa 3D)
4. Kuyika zofunikira ndi ndondomeko zoyendetsera ntchito
Kukonzekera kwa malo
Zofunikira za polojekiti
Pansi katundu wonyamula ≥1500kg/m²
Kutentha kozungulira 20 ± 3 ℃ (kutentha kosasintha)
Chinyezi cha 30-60% RH
Mafotokozedwe amagetsi 220V ± 5% / 50Hz (kukhazikika kodziyimira pawokha)
Malo ogwiritsira ntchito chitetezo
Kutsata mphamvu:
Yambitsani choziziritsa madzi choyamba → kenako yambani makina a X-ray → pomaliza yambitsani pulogalamuyo
Kuyika kwachitsanzo:
Gwiritsani ntchito chonyamulira cha ceramic (peŵani kujambula kosokoneza zitsulo)
Mphepete ya bolodi ndi ≥50mm kuchokera kumutu waukulu
5. Kuzindikira zolakwa zofala ndi chithandizo
Kuwonongeka kwa Hardware
Code Phenomenon Solution
XE101 X-ray chubu kutenthedwa Onani kayendedwe ka madzi kuzirala dongosolo (kufunika ≥2L/mphindi)
ME205 Z-axis servo abnormality Yambitsaninso dalaivala → Onani ukhondo wa sikelo ya grating
DE308 Palibe chizindikiro chochokera ku chojambulira Chojaninso mawonekedwe a Camera Link
Kulakwitsa kwa mapulogalamu
Khodi Chifukwa Chotheka Kuthetsa
3DERR07 Kumanganso algorithm kwalephera Chepetsani makulidwe agawo (ndikulimbikitsidwa ≥100μm)
Mtundu wa AICONF02 AI wotsegulira nthawi yomaliza Sinthani dalaivala wa CUDA kuti musinthe 11.4+
DBFULL11 Database yadzaza Yeretsani mbiri yakale kapena onjezerani zosungira
Kuthana ndi vuto la kujambula
Chithunzi chosawoneka bwino:
Chongani X-ray chubu focus mode (point/line mode switch)
Chotsani zenera lachitetezo cha chowunikira
Zosokoneza:
Konzani malo amdima/wowala bwino
Sinthani KV/μA parameter kuphatikiza
6. Kalozera wosamalira
Kukonza nthawi ndi nthawi
Kukonza nthawi yokhazikika Njira yokhazikika
Kuchotsa fumbi latsiku ndi tsiku mu kanyumba Gwiritsani ntchito anti-static vacuum cleaner
Magulu Opaka Mafuta Pamlungu ndi Masabata Ikani mafuta a KLUBER
Kuwunika kwachitetezo cha radiation pamwezi Gwiritsani ntchito dosimeter ya 6150AD
Kotala la X-ray chubu calibration Gwiritsani ntchito ma calibration a SAKI okhazikika
Consumable m'malo
Mbali Zosintha Zozungulira
X-ray chubu ≥30,000 maola Ayenera kusinthidwa ndi wopanga choyambirira
Kanema wodzitchinjiriza wa miyezi 12 Kanema wowongolera ayenera kugwiritsidwa ntchito
Madzi ozizira miyezi 6 Madzi oyeretsedwa amafunikira
7. Milandu yodziwika bwino yogwiritsira ntchito
Mlandu 1: Kuzindikira socket ya seva ya CPU
Zovuta:
LGA3647 socket yobisika yolumikizana ndi solder
Kufunika kwa void rate <15% (malinga ndi IPC-7095C)
Yankho:
Gwiritsani ntchito masinthidwe a 60 °
Muyezo wa 3D wa voliyumu iliyonse ya mpira wa solder
Mlandu 2: Galimoto yamagetsi IGBT module
Zofunikira zapadera:
Dziwani kuti Al wire bonding status
Kusiyanitsa SnAgCu ndi PbSn solder
Njira yoyendetsera:
Yambitsani kusanthula kwapawiri kwamphamvu (80kV/130kV switching)
Customized AI classification model
Chidule chaukadaulo
BF-3AXiM200 imatanthauziranso miyezo yamakampani kudzera m'njira zitatu zazikuluzikulu zaukadaulo:
Kujambula kwatsopano: Nano focus + photon counting detector kuti mukwaniritse kuzindikira kwa submicron level
Kusanthula kwanzeru: 3D defect automatic classification system yotengera kuphunzira mozama
Kapangidwe kachitetezo: Kuteteza kangapo kumatsimikizira kuti palibe chiwopsezo cha radiation kwa ogwiritsa ntchito