SAKI smt 3d X RAY BF-3AXiM200

SAKI X-RAY BF-3AXiM200 Full Technical Detail

1. Product Overview and Core Advantages

Product Positioning

SAKI BF-3AXiM200 is a high-end 3D X-ray automatic inspection system developed by SAKI of Japan, mainly for:

High-density packaging (such as FC-BGA, SiP)

Automotive electronics (ADAS module, power module)

Military industry and aerospace (high reliability PCB)

Five core advantages

Three-axis linkage CT scanning: X/Y/Z axis synchronous movement to achieve true 3D imaging

Nano focus X-ray tube: 0.3μm resolution (industry leading)

AI defect analysis: Deep learning algorithm automatically classifies 30+ types of welding defects

Dual energy spectrum imaging: Can distinguish different solder compositions such as Sn/Pb/Ag

Intelligent safety protection: Radiation leakage <1μSv/h (far lower than the national standard)

2. Technical specifications and system composition

Hardware configuration

Subsystem Technical parameters Features

X-ray source 160kV/65W closed tube Tungsten target, life ≥ 50,000 hours

Detector 2048×2048 pixel flat panel 100fps dynamic acquisition

Mechanical system Linear motor drive Repeat positioning accuracy ±2μm

Protection system 0.5mm lead equivalent Door interlock + emergency stop double insurance

Key performance indicators

Parameters Indicators

Maximum inspection board size 610×508mm

Minimum detectable defect 0.5μm (copper wire open circuit)

3D reconstruction accuracy ±5μm@50mm FOV

Typical inspection speed 15 seconds/slice (200μm layer thickness)

3. Detection capability and software functions

Detection items

Soldering defects:

BGA/CSP: voids, cold soldering, bridging

Through-hole soldering: insufficient tin filling, wicking effect

Assembly defects:

Component displacement, missing, polarity error

VisionX3D software functions

Intelligent detection mode:

Automatic slice planning (supports tilt scanning)

3D virtual sectioning (observation at any angle)

Data analysis:

Void rate statistics (compliant with IPC-7095 standard)

Automatically generate ORT report (including 3D model)

4. Installation requirements and operating specifications

Site preparation

Project requirements

Ground load bearing ≥1500kg/m²

Ambient temperature 20±3℃ (constant temperature)

Humidity range 30-60% RH

Power supply specifications 220V±5%/50Hz (independent grounding)

Safety operation points

Power-on sequence:

Start the water cooler first → then start the X-ray system → finally start the software

Sample placement:

Use ceramic carrier (avoid metal interference imaging)

The board edge is ≥50mm from the bulkhead

5. Common fault diagnosis and treatment

Hardware fault

Code Phenomenon Solution

XE101 X-ray tube overheating Check the flow of the water cooling system (need ≥2L/min)

ME205 Z-axis servo abnormality Restart the driver → Check the cleanliness of the grating scale

DE308 No signal from the detector Re-plug the Camera Link interface

Software fault

Code Possible cause Solution

3DERR07 Reconstruction algorithm failed Reduce the slice thickness (recommended ≥100μm)

AICONF02 AI model loading timeout Update CUDA driver to version 11.4+

DBFULL11 Database is full Clean up historical data or expand storage

Typical imaging problem handling

Blurred image:

Check the X-ray tube focus mode (point/line mode switch)

Clean the detector protection window

Artifact interference:

Perform dark field/bright field correction

Adjust KV/μA parameter combination

6. Maintenance guide

Periodic maintenance

Period Maintenance content Standard method

Daily Dust removal in the cabin Use anti-static vacuum cleaner

Weekly Lubricate moving parts Apply KLUBER grease

Monthly Radiation safety inspection Use 6150AD dosimeter

Quarterly X-ray tube calibration Use SAKI standard calibration parts

Consumable replacement

Parts Replacement cycle Notes

X-ray tube ≥30,000 hours Need to be replaced by the original manufacturer

Detector protective film 12 months Conductive film must be used

Cooling water 6 months Deionized water is required

7. Typical application cases

Case 1: Server CPU socket detection

Challenges:

LGA3647 socket hidden solder joint detection

Requirement of void rate <15% (according to IPC-7095C)

Solution:

Use 60° tilt scanning mode

3D measurement of each solder ball volume

Case 2: Electric vehicle IGBT module

Special requirements:

Detect Al wire bonding status

Distinguish SnAgCu from PbSn solder

Implementation method:

Enable dual energy spectrum scanning (80kV/130kV switching)

Customized AI classification model

Technical summary

BF-3AXiM200 redefines industry standards through three major technological breakthroughs:

Imaging innovation: Nano focus + photon counting detector to achieve submicron level detection

Intelligent analysis: 3D defect automatic classification system based on deep learning

Safety design: Multiple protections ensure zero radiation risk for operators