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SAKI smt 3d X RAY BF-3AXiM200

SAKI smt 3d X RAY BF-3AXiM200

BF-3AXiM200 redefines industry standards through three major technological breakthroughs:Imaging innovation: Nano focus + photon counting detector to achieve submicron level detection

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SAKI X-RAY BF-3AXiM200 Full Technical Detail

1. Product Overview and Core Advantages

Product Positioning

SAKI BF-3AXiM200 is a high-end 3D X-ray automatic inspection system developed by SAKI of Japan, mainly for:

High-density packaging (such as FC-BGA, SiP)

Automotive electronics (ADAS module, power module)

Military industry and aerospace (high reliability PCB)

Five core advantages

Three-axis linkage CT scanning: X/Y/Z axis synchronous movement to achieve true 3D imaging

Nano focus X-ray tube: 0.3μm resolution (industry leading)

AI defect analysis: Deep learning algorithm automatically classifies 30+ types of welding defects

Dual energy spectrum imaging: Can distinguish different solder compositions such as Sn/Pb/Ag

Intelligent safety protection: Radiation leakage <1μSv/h (far lower than the national standard)

2. Technical specifications and system composition

Hardware configuration

Subsystem Technical parameters Features

X-ray source 160kV/65W closed tube Tungsten target, life ≥ 50,000 hours

Detector 2048×2048 pixel flat panel 100fps dynamic acquisition

Mechanical system Linear motor drive Repeat positioning accuracy ±2μm

Protection system 0.5mm lead equivalent Door interlock + emergency stop double insurance

Key performance indicators

Parameters Indicators

Maximum inspection board size 610×508mm

Minimum detectable defect 0.5μm (copper wire open circuit)

3D reconstruction accuracy ±5μm@50mm FOV

Typical inspection speed 15 seconds/slice (200μm layer thickness)

3. Detection capability and software functions

Detection items

Soldering defects:

BGA/CSP: voids, cold soldering, bridging

Through-hole soldering: insufficient tin filling, wicking effect

Assembly defects:

Component displacement, missing, polarity error

VisionX3D software functions

Intelligent detection mode:

Automatic slice planning (supports tilt scanning)

3D virtual sectioning (observation at any angle)

Data analysis:

Void rate statistics (compliant with IPC-7095 standard)

Automatically generate ORT report (including 3D model)

4. Installation requirements and operating specifications

Site preparation

Project requirements

Ground load bearing ≥1500kg/m²

Ambient temperature 20±3℃ (constant temperature)

Humidity range 30-60% RH

Power supply specifications 220V±5%/50Hz (independent grounding)

Safety operation points

Power-on sequence:

Start the water cooler first → then start the X-ray system → finally start the software

Sample placement:

Use ceramic carrier (avoid metal interference imaging)

The board edge is ≥50mm from the bulkhead

5. Common fault diagnosis and treatment

Hardware fault

Code Phenomenon Solution

XE101 X-ray tube overheating Check the flow of the water cooling system (need ≥2L/min)

ME205 Z-axis servo abnormality Restart the driver → Check the cleanliness of the grating scale

DE308 No signal from the detector Re-plug the Camera Link interface

Software fault

Code Possible cause Solution

3DERR07 Reconstruction algorithm failed Reduce the slice thickness (recommended ≥100μm)

AICONF02 AI model loading timeout Update CUDA driver to version 11.4+

DBFULL11 Database is full Clean up historical data or expand storage

Typical imaging problem handling

Blurred image:

Check the X-ray tube focus mode (point/line mode switch)

Clean the detector protection window

Artifact interference:

Perform dark field/bright field correction

Adjust KV/μA parameter combination

6. Maintenance guide

Periodic maintenance

Period Maintenance content Standard method

Daily Dust removal in the cabin Use anti-static vacuum cleaner

Weekly Lubricate moving parts Apply KLUBER grease

Monthly Radiation safety inspection Use 6150AD dosimeter

Quarterly X-ray tube calibration Use SAKI standard calibration parts

Consumable replacement

Parts Replacement cycle Notes

X-ray tube ≥30,000 hours Need to be replaced by the original manufacturer

Detector protective film 12 months Conductive film must be used

Cooling water 6 months Deionized water is required

7. Typical application cases

Case 1: Server CPU socket detection

Challenges:

LGA3647 socket hidden solder joint detection

Requirement of void rate <15% (according to IPC-7095C)

Solution:

Use 60° tilt scanning mode

3D measurement of each solder ball volume

Case 2: Electric vehicle IGBT module

Special requirements:

Detect Al wire bonding status

Distinguish SnAgCu from PbSn solder

Implementation method:

Enable dual energy spectrum scanning (80kV/130kV switching)

Customized AI classification model

Technical summary

BF-3AXiM200 redefines industry standards through three major technological breakthroughs:

Imaging innovation: Nano focus + photon counting detector to achieve submicron level detection

Intelligent analysis: 3D defect automatic classification system based on deep learning

Safety design: Multiple protections ensure zero radiation risk for operators

SAKI X-RAY BF-3AXiM200

Why do so many people choose to work with GeekValue?

Our brand is spreading from city to city, and countless people have asked me, "What is GeekValue?" It stems from a simple vision: to empower Chinese innovation with cutting-edge technology. This is a brand spirit of continuous improvement, hidden in our relentless pursuit of detail and the delight of exceeding expectations with every delivery. This almost obsessive craftsmanship and dedication is not only the persistence of our founders, but also the essence and warmth of our brand. We hope you will start here and give us an opportunity to create perfection. Let us work together to create the next "zero defect" miracle.

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Contact address: No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

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