DISCO DFL7341 laser itagaragara imashini ikata ifite ibyiza nibisobanuro bikurikira:
Inyungu Kwangirika kwinshi, gukata neza-neza: DFL7341 ikoresha tekinoroji yo gukata ya laser itagaragara kugirango ikore urwego rwahinduwe gusa imbere muri wafer ya silicon, ihagarika ibisekuruza bitunganya imyanda, kandi irakwiriye kuburugero rufite ibisabwa byinshi. Ubugari bwo gukata bushobora kuba bugufi cyane, bufasha kugabanya inzira yo guca no kugabanya ibyangiritse kuri wafer
Tekinoroji yo gutunganya yumye: Ibikoresho bikoresha tekinoroji yo gutunganya yumye, kumisha no gukora isuku, kandi birakwiriye gutunganya ibintu bifite umunaniro muke
Umusaruro ufatika: DFL7341 ikwiranye nibisabwa bifite umusaruro mwinshi nka LED safiro, lithium tantalate, na sisitemu ya mikorobe-mashanyarazi (MEMS). Uburyo bwa Stealth Dicing ™ butuma ibikoresho byacika nka karubone ya silicon (SiC) na nitride ya gallium (GaN) gucibwa nta myanda.
Ubwinshi bwibisabwa: Ibikoresho birakwiriye mubikoresho bitandukanye, birimo safiro, karubide ya silicon, galiyumu ya ionisiyumu (GaAs), nibindi, kandi birashobora gutanga ibisubizo byiza byo gutunganya.
Ibisobanuro Ibice byingenzi: Harimo kuzamura cassette, convoyeur, sisitemu igamije, sisitemu yo gutunganya, sisitemu y'imikorere, icyerekezo cyerekana, moteri ya laser, chiller, nibindi.
Ibipimo nyabyo: Gukora disiki ikora: X-axis axial ukuri ≤0.002mm / 210mm, Y-axis axial ≤0. 003mm / 210mm, Y-axis ihagaze neza ≤0.002mm / 5mm, Z-axis ihagaze neza ≤0.001mm
Umuvuduko wo gutema: X-axis yo guca umuvuduko 1-1000 mm / s, Y-axis yerekana ibipimo 0.1 micron, umuvuduko wa 200 mm / s, Z-axis ya 0.1 micron, igenda 50 mm / s
Ibikoresho bikoreshwa hamwe nubunini: Gusa bishyigikira silimoni ya wafer ya milimetero ikata, uburebure bwa silicon wafer ni 0.1-0.7, ingano irenze mm 0.5. Ibishushanyo mbonera byerekana hafi ya micron imwe, kandi nta nkombe yikibaho no kutoroherwa hejuru ninyuma ya wafer