Ekyuma ekisala wafer ekya DISCO DFL7341

DISCO DFL7341 laser invisible cutting machine erina ebirungi bino wammanga n'ebikwata ku:

Ebirungi Okwonoonebwa okutono, okusala mu butuufu obw’amaanyi: DFL7341 ekozesa tekinologiya w’okusala mu ngeri ya layisi okukola oluwuzi olukyusiddwa munda mu wafer ya silikoni yokka, okunyigiriza okutondebwa kw’ebisasiro eby’okulongoosa, era nga kirungi ku sampuli ezirina ebyetaago by’obutundutundu obw’amaanyi. Obugazi bw’omukutu gw’okusala buyinza okuba obufunda ennyo, ekiyamba okukendeeza ku kkubo ly’okusala n’okukendeeza ku kwonooneka kwa wafer

Tekinologiya w’okulongoosa ebintu mu ngeri enkalu: Ekyuma kino kikozesa tekinologiya w’okulongoosa ebintu mu ngeri enkalu, okukala n’okuyonja, era kirungi okulongoosa ebintu ebiziyiza obukoowu obubi

Okukola obulungi: DFL7341 esaanira okukozesebwa n’ebyetaago by’okufulumya ebingi nga LED sapphire, lithium tantalate, ne micro-electromechanical systems (MEMS). Enkola yaayo eya Stealth DicingTM esobozesa ebintu ebimenyamenya nga silicon carbide (SiC) ne gallium nitride (GaN) okusalibwa awatali kasasiro.

Enkola ez’enjawulo: Ebyuma bino bituukira ddala ku bintu eby’enjawulo, omuli safiro, silikoni kaabuyidi, ionized gallium (GaAs), n’ebirala, era bisobola okuwa ebivudde mu kulongoosa eby’omutindo ogwa waggulu.

Ebikwata ku bitundu ebikulu: Omuli cassette lift, conveyor, aiming system, processing system, operating system, status indicator, yingini ya laser, chiller, n’ebirala.

Ebiraga obutuufu: Obutuufu bwa disiki ekola: Obutuufu bwa X-axis axial ≤0.002mm/210mm, Y-axis axial accuracy ≤0. 003mm/210mm, Y-ekisiki okuteeka obutuufu ≤0.002mm/5mm, Z-ekisiki okuteeka obutuufu ≤0.001mm

Sipiidi y’okusala: Sipiidi y’okusala eya X-axis mm 1-1000 mm/s, Y-axis dimensional resolution 0.1 micron, sipiidi y’okutambula 200 mm/s, Z-axis dimensional resolution 0.1 micron, okutambula mm 50/s

Ebikozesebwa n’obuwanvu: Ewagira okusala kwa milimita za silikoni wafer omulongoofu yokka, obuwanvu bwa silikoni wafer buli 0.1-0.7, obunene bw’empeke busukka mm 0.5. Enkula ya dicing screen eri nga micron emu, era tewali dome edge n’obutabeera bulungi ku ngulu n’emabega wa wafer