TR7700SIII ye kyuma ekiyiiya ekya 3D automatic optical inspection machine (AOI) ekikozesa enkola z’okukebera PCB ez’omugatte ez’amaanyi ennyo, tekinologiya w’okupima 3D true profile ya laser ey’amaaso ne bbululu okusobola okutumbula okubikka obulema mu kukebera okw’otoma. Ekyuma kino kigatta ebyuma ebisinga okuba eby’omulembe n’omulembe ogw’okusatu ogw’ebyuma ebigezi okusobola okuwa 3D stable and powerful 3D solder joint and component defect detection, nga kirimu ebirungi nga okubikka okunene okuzuula n’okukola pulogulaamu ennyangu.
Ebikwata ku by’ekikugu n’ebipimo by’omutindo gw’emirimu
Obusobozi bw'okukebera : TR7700SIII ewagira okukebera okw'amaanyi okwa 2D+3D era esobola okuzuula ebitundu 01005.
Sipiidi y’okukebera : Sipiidi y’okukebera eya 2D eri 60cm2/sec ku 10μm resolution; Sipiidi y’okukebera mu 2D eri 120cm2/sec ku 15μm resolution; 27-39cm2/sec mu mbeera ya 2D + 3D.
Enkola y’amaaso : Tekinologiya w’okukuba ebifaananyi mu ngeri ey’amaanyi, okupima 3D profile entuufu, amataala ga RGB+W LED aga mitendera mingi.
Tekinologiya wa 3D : Eriko sensa za layisi eza 3D emu/emirundi ebiri, 3D range esinga obunene eri mm 20 .
Ebirungi n’embeera z’okukozesa
Okubikka ebikyamu ebingi: Tekinologiya w’okukebera mu ngeri ya Hybrid 2D+3D akuwa obulema obw’amaanyi.
Tekinologiya omutuufu ow’okupima enkula ya 3D: Yuniti za layisi bbiri ziwa ebipimo ebituufu ennyo.
Intelligent programming interface: Nga tulina emirimu gya database egy’obwengula n’okukola pulogulaamu ezitali ku mutimbagano, enkola ya programming enyanguyizibwa.
Okwekenenya abakozesa n’okuteeka akatale mu kifo
TR7700SIII 3D AOI erina erinnya lya waggulu ku katale olw’omulimu gwayo ogw’amaanyi n’okubikka waggulu, era esaanira kkampuni ezikola ebyuma eby’amasannyalaze ezeetaaga okwekebejjebwa mu ngeri entuufu. Tekinologiya waayo omuyiiya ow’okukebera mu ngeri ya 3D n’emirimu gyayo egyangu egy’okukola pulogulaamu gigiwa enkizo ey’amaanyi mu by’okukebera mu ngeri ey’otoma.
Ebirungi ebikulu ebiri mu kyuma ekikebera amaaso ekya TR7700SIII 3D automatic optical inspection machine (AOI) mulimu:
Okukebera ku sipiidi ya waggulu mu 2D+3D: Ekyuma kino kikozesa enkola ey’okukebera PCB ey’omugatte ey’amaanyi ennyo, nga kigatta okupima kwa layisi eya bbululu 3D entuufu contour, esobola okuzuula ebitundu okutuuka ku 01005, n’ebirungi eby’okubikka ebikyamu ebingi n’okukola pulogulaamu ennyangu . Tekinologiya w’okupima enkula ya 3D entuufu: Kozesa yuniti za layisi bbiri okupima enkula ya 3D entuufu okukakasa nti okuzuula kutuufu.
Intelligent hardware platform: Egatta eby’okugonjoola software ebisinga okuba eby’omulembe n’omulembe ogw’okusatu intelligent hardware platform okuwa stable era ey’amaanyi 3D solder point ne component defect detection.
Okuzuula okw’obutuufu obw’amaanyi: Eriko AOI ey’obutuufu obw’amaanyi ng’erina ensibuko y’ekitangaala ey’emitendera mingi, ng’ekozesa enkola empya ey’ekifo kya langi okulongoosa obutuufu n’okukendeeza ku kusalawo okukyamu.
Intelligent fast programming interface: Eriko database ey’obwengula n’emirimu gya pulogulaamu ezitali ku mukutu okwanguyiza enkola ya pulogulaamu