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TRI TR7700SIII SMT 3D AOI Inspection System

TRI TR7700SIII SMT 3D AOI Inkqubo yokuhlola

I-TR7700SIII ixhasa uhlolo olukhawulezayo lwe-2D + 3D kwaye inokubona izinto ze-01005

Iinkcukacha

I-TR7700SIII ngumatshini wokuhlola ozenzekelayo we-3D ozenzekelayo (i-AOI) osebenzisa iindlela zokuhlola i-PCB ye-ultra-high-speed hybrid, i-laser ye-3D ye-optical kunye ne-blue ye-3D yokwenyani iteknoloji yokulinganisa iprofayili ukunyusa ukugubungela isiphene sokuhlola okuzenzekelayo. Isixhobo sidibanisa ezona zisombululo zesoftware eziphambili kunye neqonga le-hardware elikrelekrele kwisizukulwana sesithathu ukubonelela ngokuzinzileyo kunye namandla okuhlangana kwe-3D ye-solder kunye necandelo lokufumanisa isiphene, kunye neenzuzo ezifana nokubhaqwa okuphezulu kunye neprogram elula.

Iinkcukacha zobugcisa kunye neeparamitha zokusebenza

Ukuhlola amandla : I-TR7700SIII isekela ukuhlolwa kwe-2D + ye-3D ephezulu kwaye inokubona amacandelo e-01005.

Isantya sokuhlola : Isantya sokuhlolwa kwe-2D yi-60cm²/sec kwisisombululo se-10µm; Isantya sokuhlola i-2D yi-120cm²/sec kwisisombululo se-15µm; 27-39cm²/umzuzwana kwimo ye-2D+3D.

Inkqubo yokubona : Itekhnoloji yokucinga enamandla, umlinganiselo weprofayile ye-3D eyinyani, izigaba ezininzi zeRGB + W ukukhanya kwe-LED.

Itekhnoloji ye-3D: Ixhotyiswe nge-laser eyodwa / ezimbini ze-3D ze-laser, uluhlu oluphezulu lwe-3D luyi-20mm.

Izinto eziluncedo kunye neemeko zesicelo

Ukugubungela isiphene esiphakamileyo: Itekhnoloji yokuhlola iHybrid 2D + 3D ibonelela ngokhuseleko oluphezulu.

Itekhnoloji yomlinganiselo we-3D wecontour: Iiyunithi ezimbini zelaser zibonelela ngemilinganiselo echanekileyo.

Ujongano lwenkqubo olukrelekrele: Ngolwazi oluzenzekelayo kunye nemisebenzi yeprogram engaxhunyiwe kwi-intanethi, inkqubo yokucwangcisa yenziwa lula.

Uvavanyo lomsebenzisi kunye nokuma kwemarike

I-TR7700SIII 3D AOI yonwabela udumo oluphezulu kwimarike yokusebenza kwayo okuphezulu kunye nokugubungela okuphezulu, kwaye ifanelekile kwiinkampani ezivelisa i-elektroniki ezifuna uhlolo oluchanekileyo. Itekhnoloji yokuhlola i-3D entsha kunye nemisebenzi elula yokucwangcisa inika inzuzo ebalulekileyo kwintsimi yokuhlola okuzenzekelayo.

Ezona zinto ziluncedo kumatshini wokuhlola i-TR7700SIII 3D oluzenzekelayo (AOI) ziquka:

Isantya esiphezulu se-2D + i-3D yokuhlola: Isixhobo sisebenzisa indlela yokuhlola ye-PCB ye-ultra-high-speed hybrid, edibanisa i-optical kunye ne-blue laser 3D yokulinganisa i-contour yokwenyani, ekwaziyo ukufumanisa amacandelo ukuya kwi-01005, kunye neenzuzo zokugubungela isiphene esiphezulu kunye neprogram elula. . Itekhnoloji yokwenyani ye-3D yomlinganiselo wecontour: Sebenzisa iiyunithi ezimbini zelaser kumlinganiselo wokwenyani we-3D wecontour ukuqinisekisa ukuchaneka kobhaqo.

Iqonga le-Hardware elikrelekrele: Idibanisa ezona zisombululo zesoftware ephucukileyo kunye neqonga le-hardware yesizukulwana sesithathu ukubonelela ngeendawo ezizinzileyo nezinamandla ze-3D ze-solder kunye nobhaqo lwesiphene secandelo.

Ukubona ngokuchanekileyo okuphezulu: Ukuxhotyiswa nge-AOI ephezulu kunye nomthombo wokukhanya wamanqanaba amaninzi, usebenzisa i-algorithm yendawo yombala omtsha ukuphucula ukuchaneka nokunciphisa ukugwetywa.

Ujongano lwenkqubo olukrelekrele olukhawulezayo: Ixhotyiswe ngesiseko sedatha esizenzekelayo kunye nemisebenzi yenkqubo engaxhunyiwe kwi-intanethi ukwenza lula inkqubo yokucwangcisa.

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