Name: Iziko loNikezo lweZixhobo
Brand: GEEKVALUE machine

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65% yesaphulelo

SAKI smt 3D SPI machine 3Si-MS2

I-SAKI 3Si-MS2 sisizukulwana esitsha se-3D yenkqubo yokuhlola i-solder paste (SPI) esungulwe ngu-SAKI. Yamkela itekhnoloji yokulinganisa i-multi-spectral kwaye yenzelwe ukuhambelana nomgangatho ...
60% yesaphulelo

SAKI 3Si-LS2 SMT 3D SPI umatshini

I-SAKI 3Si-LS2 sisixhobo sokuhlola ukuncamathisela kwe-3D ephucukileyo (SPI) esebenzisa itekhnoloji yelaser triangulation kwaye iyilelwe inkqubo yoshicilelo lwenkqubo yoshicilelo oluchanekileyo.
65% yesaphulelo

SAKI smt 2d ooi umatshini BF-TristarⅡ

I-SAKI BF-TristarⅡ sisizukulwana esitsha se-2D yenkqubo yokuhlola okuzenzekelayo (AOI) eyasungulwa ngu-SAKI, eyilelwe ukuhlolwa kwendibano yePCB echanekileyo.
60% yesaphulelo

SAKI 2d aoi smt Umatshini woHlolo oluSebenzayo oluSebenzayo lwe-BF-LU1

I-SAKI BF-LU1 sisixhobo sokuhlola esisebenza kakuhle esinamacala amabini (AOI) esinikezelwe kuhlolo lomgangatho wePCB (ibhodi yesekethe eprintiweyo) kwi-SMT.
70% yesaphulelo

SAKI 3Di-LS3 smt 3d ooi umatshini

I-SAKI 3Di-LS3 sisixhobo sokuhlola i-3D esisebenza ngokuphezulu esizenzekelayo (i-AOI) eyenzelwe ushishino lokuvelisa i-elektroniki ukuze ibone iziphene ze-welding.
65% yesaphulelo

SAKI 3D ooi umatshini 3Di MS2

I-SAKI 3Di MS2 iye yaba sisixhobo esibalulekileyo sokulawula umgangatho kwimigca yemveliso ye-SMT yangoku kunye nokuchaneka kwayo okuphezulu kwe-3D + i-algorithm yobukrelekrele ye-AI.
65% yesaphulelo

I-SAKI 3D AOI SMT Umatshini woHlolo oluSebenzayo oluSebenzayo lwe-3Di MD2

I-SAKI 3Di MD2 sisixhobo sokuhlola okuzenzekelayo se-3D esisebenza ngokukhawuleza (AOI) esasungulwa ngu-SAKI waseJapan. Yenzelwe ukwenziwa kwe-elektroniki yale mihla kwaye isetyenziselwa ukuhlolwa komgangatho ophezulu...
70% yesaphulelo

SAKI smt 3D SPI machine 3Si-LS3EX

I-SAKI 3Si-LS3EX yinkqubo yokuhlola i-solder paste yamva nje ye-3D (SPI) esungulwe ngu-SAKI waseJapan. Yamkela itekhnoloji yokucinga ye-multi-spectral confocal
65% yesaphulelo

SAKI BF-3Si-L2 SMT 3D SPI Machine

I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D echanekileyo ephezulu (SPI) esungulwe ngu-SAKI waseJapan, eyilelwe ngokukodwa ukulawula umgangatho wenkqubo yokushicilela i-solder paste...
65% yesaphulelo

SAKI smt 3d x-reyi bf-3axim200

I-BF-3AXiM200 ichaza kwakhona imigangatho yoshishino ngokusebenzisa iimpumelelo ezintathu ezinkulu zetekhnoloji: Ukwenziwa komfanekiso omtsha: Ujoliso lweNano + umtshini wokubala wefoton ukufezekisa ukuchongwa kwenqanaba le-submicron.
60% yesaphulelo

SAKI BF-10D SMT 2D umatshini AOI

I-SAKI BF-10D sisizukulwana esitsha se-2D esizenzekelayo sokuhlola izixhobo (AOI) esaphehlelelwa yi-SAKI Co., Ltd. yaseJapan.
60% yesaphulelo

SAKI smt 2D AOI umatshini BF-Planet-XII

I-SAKI 2D AOI BF-Planet-XII sisixhobo sokuhlola esizenzekelayo esizenzekelayo (AOI) esiphuhliswe ngu-SAKI waseJapan.
60% yesaphulelo

SAKI 3Di-MS3 SMT 3D umatshini AOI

I-SAKI 3Di-MS3 sisizukulwana esitsha se-3D yokuhlola okuzenzekelayo (i-AOI) izixhobo, eyenzelwe ukuhlolwa kwe-PCB ephezulu echanekileyo (PCBA).
70% yesaphulelo

SAKI smt 3D AOI 3Di-LS3EX

I-SAKI 3Di-LS3EX sisixhobo esiphezulu sokuhlola okuzenzekelayo kwe-3D (i-AOI) eyenzelwe i-solder joints, ukubekwa kwecandelo kunye nokufunyanwa kwesiphako se-PCB assembly (PCBA)
60% yesaphulelo

SAKI smt 3d X-RAY umatshini BF-3AXiM110

I-SAKI X-RAY BF-3AXiM110 yinkqubo yokuhlola ezenzekelayo yeX-reyi esebenza ngokuphezulu eyenzelwe iimfuno zokuhlolwa kwebhodi yePCB kushishino lokwenziwa kombane.
65% yesaphulelo

I-oveni yokuphuma kwakhona i-jt ns-800ⅱ-n

I-Oven ye-JT Reflow NS-800Ⅱ-N isetyenziselwa ikakhulu ukuwelda, ilungele iimfuno zemveliso yeendibano zocweyo ze-SMT.
60% yesaphulelo

jt smt reflow soldering oven ktd-1204-n

Amandla okulawula ubushushu obunamandla, iseti kunye nokwenyani umahluko wobushushu ungaphakathi kwe-1.0 ℃
65% yesaphulelo

I-jt iphinde ikhuphe i-oveni endala-800-n

I-JT Reflow Oven i-JIR-800-N ithatha itekhnoloji yokufudumeza ephezulu, enokunyusa ngokukhawuleza nangokulinganayo iqondo lobushushu kwiziko ukuqinisekisa inkqubo esebenzayo yokuwelda.
65% yesaphulelo

samsung smt umshicileli wesikrini sp3-c

Ixesha lomjikelo woshicilelo yimizuzwana emi-5 (ngaphandle kwexesha lokushicilela), elilungele iimfuno zokuvelisa ngesantya esiphezulu.
65% yesaphulelo

samsung smt isishicileli sestencil sp2-c

Ukuchaneka koshicilelo lwe-SP2-C yomshicileli we-solder paste yi ±15um@6σ, kunye nokuchaneka okumanzi koshicilelo yi-±25um@6σ.
70% yesaphulelo

umshicileli we-hanwha smt wesikrini sp1-w

Umshicileli we-Hanwha SP1-W sishicileli sokuncamathisela se-solder esisebenza ngokugqibeleleyo, sisetyenziswa ikakhulu kushicilelo lwe-solder paste kwi-SMT.

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