Quick Search
product FAQ
SAKI 3Si-MS2 is a new generation of 3D solder paste inspection system (SPI) launched by SAKI. It adopts innovative multi-spectral measurement technology and is designed for quality con...
SAKI 3Si-LS2 is an advanced 3D solder paste inspection equipment (SPI) that uses laser triangulation technology and is designed for high-precision solder paste printing process quality control
SAKI BF-TristarⅡ is a new generation of 2D automatic optical inspection system (AOI) launched by SAKI, designed for high-precision PCB assembly inspection
SAKI BF-LU1 is a high-performance two-dimensional automatic optical inspection equipment (AOI) dedicated to the quality inspection of PCB (printed circuit board) in SMT
SAKI 3Di-LS3 is a high-performance 3D automatic optical inspection equipment (AOI) designed for the electronics manufacturing industry to detect welding defects
SAKI 3Di MS2 has become an important quality control equipment for modern SMT production lines with its high-precision 3D detection + AI intelligent algorithm
SAKI 3Di MD2 is a high-performance 3D automatic optical inspection (AOI) equipment launched by SAKI of Japan. It is designed for modern electronic manufacturing and is used for high-quality inspection...
SAKI 3Si-LS3EX is the latest high-end 3D solder paste inspection system (SPI) launched by SAKI of Japan. It adopts multi-spectral confocal imaging technology
SAKI BF-3Si-L2 is a high-precision 3D solder paste inspection system (SPI) launched by SAKI of Japan, which is specially designed for the quality control of solder paste printing proce...
BF-3AXiM200 redefines industry standards through three major technological breakthroughs:Imaging innovation: Nano focus + photon counting detector to achieve submicron level detection
SAKI BF-10D is a new generation of 2D automatic optical inspection (AOI) equipment launched by SAKI Co., Ltd. of Japan
SAKI 2D AOI BF-Planet-XII is a high-precision automatic optical inspection (AOI) equipment developed by SAKI of Japan.
SAKI 3Di-MS3 is a new generation of 3D automatic optical inspection (AOI) equipment, designed for high-precision PCB assembly (PCBA) inspection.
SAKI 3Di-LS3EX is a high-performance 3D automatic optical inspection (AOI) device designed for solder joints, component placement and defect detection of PCB assembly (PCBA)
SAKI X-RAY BF-3AXiM110 is a high-performance automatic X-ray inspection system designed for PCB board inspection needs in the electronics manufacturing industry
JT Reflow Oven NS-800Ⅱ-N is mainly used for welding, suitable for the production needs of SMT workshops
Strong temperature control ability, the set and actual temperature difference is within 1.0℃
JT Reflow Oven JIR-800-N adopts advanced heating technology, which can quickly and evenly increase the temperature in the furnace to ensure the efficient welding process
The printing cycle time is 5 seconds (excluding printing time), which is suitable for high-speed production needs
The printing accuracy of SP2-C solder paste printer is ±15um@6σ, and the wet printing accuracy is ±25um@6σ
Hanwha Printer SP1-W is a high-performance fully automatic solder paste printer, mainly used for solder paste printing in the SMT
About Us
As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
product
SAKI AOI smt machine Semiconductor equipment pcb machine Label machine other equipmentSMT line solution
© All Rights Reserved. Technical Support:TiaoQingCMS
en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho