I-Mirtec SMT 3D SPI VCTA-V850

I-VCTA-V850 sisikhangeli sobukhulu bokuncamathisela kwe-solder, esisetyenziswa kakhulu ukubona ubukhulu bencama ye-solder kunye nokuqinisekisa umgangatho wokwenziwa kwepetshi.

Imisebenzi kunye neendima

Imisebenzi ephambili yeVCTA-V850 ibandakanya:

Ukubona ubukhulu be-Solder paste: Ngokusebenzisa inkcazo ephezulu, iikhamera ezinesantya esiphezulu ezineelensi zetelecentric ekwibala eliphezulu, umlinganiselo ochanekileyo wobunzima be-solder paste uyaphunyezwa.

Ukudubula kwesakhelo esiphakamileyo: Itekhnoloji ye-GPU enkulu ehambelanayo isetyenziselwa ukuphucula ukubala kunye nesantya sobhaqo, kunye nokujongana ngempumelelo neengxaki ezifana ne-FPC warping.

Umboniso womfanekiso westereo onamacala amathathu: Inqanaba lobuchwephesha bokulinganisa iprofayile yokulinganisa (PMP) isetyenziselwa ukufumana imilo yento echanekileyo ephezulu kunye neziphumo zokulinganisa umthamo, kunye nokubonisa umbala wokwenyani wemifanekiso yestereo enamacala amathathu.

Iimodyuli ezisebenzayo ezahlukeneyo: Kubandakanya ukubonwa kweglue ebomvu, inkqubo yokufunda yebhodi engenanto, imbuyekezo yokugoba yebhodi ezenzekelayo, ukuqaphela ikhowudi yekhamera, ukucwangciswa kwe-intanethi kunye nokulungiswa kweengxaki kunye neminye imisebenzi.

Iiparamitha zobugcisa

Isisombululo sokubona: isisombululo se-8-bit grayscale, sifikelela kwisisombululo sokubhaqa se-0.37 microns.

Ukufumanisa amandla: Xa kuthelekiswa nokuchaneka komlinganiselo we-laser, ukuchaneka kuphuculwe ngemiyalelo ye-2 yobukhulu, obuphucula kakhulu amandla okubona kunye noluhlu lwesicelo sezixhobo.

Isiphumo sokubonisa: Ukwamkela i-RGB yomthombo wokukhanya wemibala emithathu, i-3D kunye ne-2D imifanekiso yombala wenyani iyafezekiswa, kwaye umphumo wokubonisa usondele kakhulu kwinto yokwenyani.

Imeko yesicelo

I-VCTA-V850 ifanelekile kwintsimi ye-SMT patch processing, ngokukodwa kwindawo efuna ukubonwa kobukhulu be-solder. Ukuchazwa kwayo okuphezulu kunye nokuchaneka okuphezulu kwenza ukuba kube noluhlu olubanzi lwamathemba okusebenza kwishishini lokuvelisa i-elektroniki

Umvavanyi wobunzima be-solder ye-SMT inokubona ezi meko zilandelayo zinganqwenelekiyo:

Umthamo wokushicilela we-solder ungonelanga okanye ugqithise kakhulu: Ngokulinganisa ubukhulu be-solder paste, kunokugwetywa ukuba umthamo wokushicilela we-solder paste udibana nomgangatho, ukuphepha ingxaki yokunganeliseki kwe-solder paste ebangela i-welding engazinzanga okanye i-solder i-paste eninzi eyenza isiphaluka esifutshane.

I-Solder Cola ukuphambuka kobude bokushicilela: Umvavanyi unokulinganisa ukuphakama kwe-solder paste kwaye abone ukuba kukho izinto ezingalinganiyo ezifana nokutsala i-tip kunye nokuwa, okuya kuchaphazela umgangatho we-welding.

Indawo yokuprinta ye-solder enganeleyo okanye umthamo: Ngokulinganisa indawo kunye nomthamo we-solder paste, inokugwetywa ukuba i-solder paste igubungela i-pad ngokulinganayo, ukuphepha imeko ye-solder eqhubekayo okanye i-welding engazinzanga ngexesha lokudibanisa.

Ingxaki ye-Solder paste yoshicilelo lwe-flatness: Umvavanyi unokubona ukuqhubeka, ukudilika, kunye nokubethelwa kwe-solder paste kwi-PCB pad, eya kuchaphazela umgangatho we-welding.