asm siplace x3s smt ekintu ekisimba chip

Siemens X3S SMT (SIPLACE X3S) kyuma kinywevu era kikola ebintu bingi nga kirimu ebirungi n’ebikwata ku bintu bino wammanga:

Ebirungi ebirimu

Ekola emirimu mingi: X3S SMT erina cantilevers ssatu era esobola okuteeka ebitundu okuva ku 01005 okutuuka ku 50x40mm, okutuukiriza ebyetaago by’okufulumya ebitundu ebitono n’eby’enjawulo

Obutuufu obw’amaanyi: Obutuufu bw’okuteeka butuuka ku ±41 microns (3σ), ate obutuufu obw’enjuba buli ±0.4° (C&P) okutuuka ku ±0.2° (P&P), okukakasa ebikolwa eby’okuteeka mu butuufu obw’amaanyi

Obulung’amu obw’amaanyi: Sipiidi ey’enzikiriziganya esobola okutuuka ku bitundu 127,875 buli ssaawa, sipiidi ya IPC eri 78,100cph, ate sipiidi ya SIPLACE benchmark evaluation eri 94,500cph

Enkola y’okuliisa ekyukakyuka: Ewagira modulo ez’enjawulo ez’okuliisa, omuli ebigaali by’ebitundu bya SIPLACE, emmere ya matrix tray (MTC), waffle trays (WPC), n’ebirala Kakasa nti oliisa bulungi

Okuddaabiriza okw’amagezi: Endagaano z’okuddaabiriza ez’ekikugu zikakasa nti ebyuma biwa omulimu n’obutuufu obulagiddwa mu bulamu bwabyo bwonna

Ebikwata ku kyuma Sayizi: 1.9x2.3 mita

Ebintu ebikwata ku mutwe gw’okuteeka: Tekinologiya wa MultiStar

Ebitundu ebikola: 01005 okutuuka ku 50x40mm

Obutuufu bw’okuteeka: ±41 micron/3σ (C&P) okutuuka ku ±34 micron/3σ (P&P)

Obutuufu bw’enjuba: ±0.4°/3σ (C&P) okutuuka ku ±0.2°/3σ (P&P)

Obugulumivu bw’ekitundu obusinga obunene: mm 11.5

Amaanyi g’okuteeka: 1.0-10 Newton

Ekika kya conveyor: Omutendera gumu, omutendera ogw’emirundi ebiri ogukyukakyuka

Enkola ya conveyor: Enkola y’okuteeka etali ya kiseera kimu, etali ya kiseera kimu, eyetongodde (X4i S) .

Enkola ya PCB: 50x50mm okutuuka ku 850x560mm

Obugumu bwa PCB: 0.3-4.5mm (sayizi endala zisangibwa ku kusaba)

Obuzito bwa PCB: max. Kkiro 3

Obusobozi bw’okuliisa: Module z’emmere ya mm 8 160