i-asm siplace x3s smt chip mounter

I-Siemens X3S SMT (SIPLACE X3S) ngumatshini ozinzileyo noguquguqukayo onezi nzuzo zilandelayo kunye neenkcukacha:

Iingenelo

I-Versatility: I-X3S SMT ine-cantilever ezintathu kwaye inokunyusa amacandelo ukusuka ku-01005 ukuya kwi-50x40mm, ukuhlangabezana neemfuno zebhetshi encinci kunye nemveliso eyahlukeneyo.

Ukuchaneka okuphezulu: Ukuchaneka kokubekwa kufikelela kwi-± 41 microns (3σ), kwaye ukuchaneka kwe-angular ± 0.4 ° (C & P) ukuya ku-± 0.2 ° (P & P), ukuqinisekisa imiphumo yokubeka ngokuchanekileyo

Ukusebenza okuphezulu: Isantya sethiyori sinokufikelela kumacandelo angama-127,875 ngeyure, isantya se-IPC yi-78,100cph, kunye nesantya sovavanyo lwebenchmark ye-SIPLACE yi-94,500cph.

Inkqubo yokutya eguquguqukayo: Ixhasa iimodyuli ezahlukeneyo ze-feeder, kubandakanywa iinqwelo zecandelo le-SIPLACE, i-matrix tray feeders (MTC), i-waffle tray (WPC), njl.

Ulondolozo lwe-Smart: Iikhontrakthi zolondolozo ziqinisekisa ukuba isixhobo sibonelela ngokusebenza okuxeliweyo kunye nokuchaneka kuwo wonke umjikelo wobomi baso

Iinkcukacha Ubungakanani bomatshini: 1.9x2.3 yeemitha

Iimpawu zentloko yokubeka: Iteknoloji ye-MultiStar

Uluhlu lwamacandelo: 01005 ukuya ku-50x40mm

Ukuchaneka kokubekwa: ±41 micron/3σ (C&P) ukuya ±34 micron/3σ (P&P)

Ukuchaneka kwe-angular: ±0.4°/3σ (C&P) ukuya ku-±0.2°/3σ (P&P)

Ubude becandelo eliphezulu: 11.5 mm

Amandla okubeka: 1.0-10 Newton

Uhlobo lomhambisi: Ingoma enye, ingoma ebhetyebhetye kabini

Imo yokuhambisa: I-Asynchronous, i-synchronous, imo yokubeka ezimeleyo (X4i S)

Ifomati yePCB: 50x50mm ukuya ku-850x560mm

Ubukhulu bePCB: 0.3-4.5mm (obunye ubungakanani bufumaneka xa uceliwe)

Ubunzima bePCB: max. 3 kg

Umthamo wesondlo: iimodyuli ze-160 8mm feeder