Ekyuma kya SAKI 3D SPI 3Si LS2

SAKI 3D SPI 3Si LS2 nkola ya 3D ey’okukebera solder paste, okusinga ekozesebwa okwekenneenya omutindo gw’okukuba solder paste ku printed circuit boards (PCBs).

Ebintu ebikulu n’embeera z’okukozesa

SAKI 3Si LS2 erina ebintu bino ebikulu:

Obutuufu obw’amaanyi: Awagira resolutions ssatu eza 7μm, 12μm, ne 18μm, ezisaanira ebyetaago by’okukebera solder paste ez’obutuufu obw’amaanyi.

Obuwagizi bwa format ennene: Buwagira sayizi za circuit board okutuuka ku yinsi 19.7 x 20.07 (500 x 510 mm), ezisaanira embeera ez’enjawulo ez’okukozesa.

Z-axis solution: Innovative Z-axis optical head control function esobola okuzuula ebitundu ebya waggulu, crimped ebitundu ne PCBAs mu fixtures, okukakasa okukebera okutuufu ebitundu ebya waggulu.

Okukebera mu 3D: Ewagira emitendera gya 2D ne 3D, ng’obugulumivu obusinga obunene butuuka ku mm 40, nga busaanira ebitundu ebizibu ebiteekebwa ku ngulu.

Ebikwata ku by’ekikugu n’ebipimo by’omutindo gw’emirimu

Ebikwata ku by’ekikugu n’ebipimo by’omutindo gwa SAKI 3Si LS2 mulimu:

Okusalawo: 7μm, 12μm ne 18μm

Sayizi ya PCB: Esinga obunene yinsi 19.7 x 20.07 (500 x 510 mm)

Obugulumivu obusinga obunene okupima: mm 40

Sipiidi y’okuzuula: 5700 square millimeters/second

Okuteeka akatale mu mbeera n’okwekenneenya abakozesa

SAKI 3Si LS2 eteekeddwa ku katale ng’enkola ey’okukebera solder paste eya 3D mu ngeri entuufu ey’okukozesa mu makolero ezeetaaga okukeberebwa mu ngeri entuufu. Okwekenenya kw’abakozesa kulaga nti enkola eno ekola bulungi mu butuufu bw’okukebera n’obulungi, ekiyinza okulongoosa ennyo obulungi bw’okufulumya n’omutindo gw’ebintu.

Ebirungi bya SAKI 3Si LS2 mu by’okukebera solder paste mu ngeri ya 3D (SPI) okusinga byeyolekera mu bintu bino wammanga:

Obutuufu obw’amaanyi n’okuddiŋŋana: SAKI 3Si LS2 ekozesa tekinologiya ow’omulembe ow’okupima 3D, ng’agattiddwa wamu n’ebifaananyi bya 2D n’okukakasa obuwanvu bwa 3D, okutuuka ku kwekebejja okutuufu ennyo. Ensengeka yaayo eya hardware erimu enkola ya closed-loop, dual servo motor drive system, high-resolution linear scale, n’ensengeka ya gantry enkalu okukakasa nti okupima kutuufu era nga kuddibwamu.

Obusobozi bw’okukebera mu ngeri ennene: Ekyuma kino kiwagira okukebera mu ngeri ennene, nga kirimu sayizi ya circuit board esinga obunene okutuuka ku yinsi 19.7 x 20.07 (500 x 510 mm), era kiwa resolutions ssatu eza 7μm, 12μm, ne 18μm, ezisaanira ekika eky’enjawulo wa embeera z’okukozesa.

Okugatta layini y’okufulumya obulungi: SAKI 3Si LS2 erina eky’okugonjoola ekya M2M, ekiyinza okutegeera obulungi omulimu gw’okufuga enzigale (closed-loop control function) ogw’ebyuma bya layini y’okufulumya, okuddiza ebivudde mu kwekebejja eri ekyuma ekikuba ebitabo eky’omu maaso n’ekyuma ekiteeka emabega, era mu magezi okutereeza okukuba ebitabo mu solder paste n’okuteeka ebitundu, bwe kityo ne kirongoosa okufulumya obulungi n’omutindo gwa layini yonna ey’okukuŋŋaanya.